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專利授權區
專利名稱(中)	金屬化玻璃基板及其製造方法
專利名稱(英)	METALLIZED GLASS SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
專利家族	中華民國：(公開號)
專利權人
發明人	衛子健
技術領域	材料化工,工業工程

專利摘要(中)
本發明公開一種金屬化玻璃基板及其製造方法。金屬化玻璃基板包括一玻璃基板、一異質接著層及一金屬層。異質接著層設置於玻璃基板上，異質接著層包括一多孔結構及一金屬觸媒。多孔結構形成於玻璃基板上，多孔結構的厚度為210奈米至350奈米。金屬觸媒附著於多孔結構上。異質接著層的微觀結構中包括矽－氧－鈦鍵結。金屬層設置於異質接著層上。

專利摘要(中)

本發明公開一種金屬化玻璃基板及其製造方法。金屬化玻璃基板包括一玻璃基板、一異質接著層及一金屬層。異質接著層設置於玻璃基板上，異質接著層包括一多孔結構及一金屬觸媒。多孔結構形成於玻璃基板上，多孔結構的厚度為210奈米至350奈米。金屬觸媒附著於多孔結構上。異質接著層的微觀結構中包括矽－氧－鈦鍵結。金屬層設置於異質接著層上。

專利摘要(英)
A metallized glass substrate and a method for manufacturing the same are provided. The metallized glass substrate includes a glass substrate, a heterogeneous bonding layer, and a metal layer. The heterogeneous bonding layer is disposed on the glass substrate. The heterogeneous bonding layer includes a porous structure and a metal catalyst. The porous structure is formed on the glass substrate. A thickness of the porous structure ranges from 210 nm to 350 nm. The metal catalyst is attached on the porous structure. A microstructure of the porous structure includes a Si-O-Ti bond. The metal layer is disposed on the heterogeneous bonding layer.

專利摘要(英)

A metallized glass substrate and a method for manufacturing the same are provided. The metallized glass substrate includes a glass substrate, a heterogeneous bonding layer, and a metal layer. The heterogeneous bonding layer is disposed on the glass substrate. The heterogeneous bonding layer includes a porous structure and a metal catalyst. The porous structure is formed on the glass substrate. A thickness of the porous structure ranges from 210 nm to 350 nm. The metal catalyst is attached on the porous structure. A microstructure of the porous structure includes a Si-O-Ti bond. The metal layer is disposed on the heterogeneous bonding layer.

聯絡資訊
承辦人姓名	李馥如
承辦人電話	03-5715131 #34576
承辦人Email	fujulee@mx.nthu.edu.tw