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專利授權區
專利名稱(中)	平面電感器及其製造方法
專利名稱(英)	PLANAR INDUCTOR
專利家族	中華民國：(公開號)
專利權人	國立清華大學 100.00%
發明人	黃敬源,徐碩鴻
技術領域	電子電機

專利摘要(中)
一種平面電感器包括第一基板、第二基板、多個第一條狀導體、多個第二條狀導體、第一平坦層、第二平坦層、第一磁性層、至少一第一接合墊以及至少一第二接合墊。多個第一條狀導體與至少一第一接合墊設置在第一基板上，且彼此電性連接。多個第二條狀導體與至少一第二接合墊設置在第二基板上，且彼此電性連接。第一平坦層覆蓋多個第一條狀導體。第二平坦層覆蓋多個第二條狀導體。第一磁性層設置在第一平坦層上。至少一第一接合墊電性接合至至少一第二接合墊以電性導通多個第一條狀導體與多個第二條狀導體。

專利摘要(中)

一種平面電感器包括第一基板、第二基板、多個第一條狀導體、多個第二條狀導體、第一平坦層、第二平坦層、第一磁性層、至少一第一接合墊以及至少一第二接合墊。多個第一條狀導體與至少一第一接合墊設置在第一基板上，且彼此電性連接。多個第二條狀導體與至少一第二接合墊設置在第二基板上，且彼此電性連接。第一平坦層覆蓋多個第一條狀導體。第二平坦層覆蓋多個第二條狀導體。第一磁性層設置在第一平坦層上。至少一第一接合墊電性接合至至少一第二接合墊以電性導通多個第一條狀導體與多個第二條狀導體。

專利摘要(英)
A planar inductor including a first substrate, a second substrate, a plurality of first strip conductors, a plurality of second strip conductors, a first planarization layer, a second planarization layer, a first magnetic layer, at least one first bonding pad and at least one second bonding pad is provided. The plurality of first strip conductors and the at least one first bonding pad are disposed on the first substrate and are electrically connected to each other. The plurality of second strip conductors and the at least one second bonding pad are disposed on the second substrate and are electrically connected to each other. The first planarization layer covers the plurality of first strip conductors. The second planarization layer covers the plurality of second strip conductors. The first magnetic layer is disposed on the first planarization layer. The at least one first bonding pad is electrically bonded to the at least one second bonding pad to electrically connect the plurality of first strip conductors and the plurality of second strip conductors.

專利摘要(英)

A planar inductor including a first substrate, a second substrate, a plurality of first strip conductors, a plurality of second strip conductors, a first planarization layer, a second planarization layer, a first magnetic layer, at least one first bonding pad and at least one second bonding pad is provided. The plurality of first strip conductors and the at least one first bonding pad are disposed on the first substrate and are electrically connected to each other. The plurality of second strip conductors and the at least one second bonding pad are disposed on the second substrate and are electrically connected to each other. The first planarization layer covers the plurality of first strip conductors. The second planarization layer covers the plurality of second strip conductors. The first magnetic layer is disposed on the first planarization layer. The at least one first bonding pad is electrically bonded to the at least one second bonding pad to electrically connect the plurality of first strip conductors and the plurality of second strip conductors.

聯絡資訊
承辦人姓名	李曉琪
承辦人電話	03-5715131 #31061
承辦人Email	hsiaochi@mx.nthu.edu.tw