| A method for manufacturing a semiconductor device includes forming a van der Waals structure between metal and semiconductor. The method further includes: depositing a protective layer on a two-dimensional semiconductor layer, then patterning the protective layer and the two-dimensional semiconductor layer, forming a first electrode and a second electrode on the protective layer, and completely removing the protective layer, thereby forming a van der Waals contact between the first electrode and the semiconductor layer, as well as between the second electrode and the semiconductor layer. |