專利授權區國立清華大學國際產學營運總中心 Operations Center for Industry Collaboration

專利授權區
專利名稱(英)	Apparatus of Three-Dimensional Integrated-Circuit Chip Using Fault-Tolerant Test Through-Silicon-Via
專利家族	美國：9,304,167
專利權人	國立清華大學 100.00%
發明人	陳福偉,黃婷婷
技術領域	資訊工程,電子電機

專利摘要(英)
An apparatus of three-dimensional integrated-circuit (3D-IC) chip is provided. The apparatus uses a test through-silicon-via (TSV). The test TSV is used as a redundant TSV operated under a normal mode. Vice versa, the test TSV is remained to be used as a traditional test TSV under a scan mode. The present invention significantly reduces the number of redundant TSVs and the production cost of the chip.

專利摘要(英)

An apparatus of three-dimensional integrated-circuit (3D-IC) chip is provided. The apparatus uses a test through-silicon-via (TSV). The test TSV is used as a redundant TSV operated under a normal mode. Vice versa, the test TSV is remained to be used as a traditional test TSV under a scan mode. The present invention significantly reduces the number of redundant TSVs and the production cost of the chip.

聯絡資訊
承辦人姓名	李曉琪
承辦人電話	03-5715131 #31061
承辦人Email	hsiaochi@mx.nthu.edu.tw

電　話：

+886-3-5162301

傳　真：

+886-3-5162275

信　箱：

ocic@my.nthu.edu.tw

地　址：

300044 新竹市光復路二段101號國立清華大學創新育成大樓 113室