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專利授權區

專利授權區
專利名稱(英)	THERMAL RADIATION HEAT DISSIPATION DEVICE FOR ELECTRONIC COMPONENT AND PREPARATION METHOD THEREOF
專利家族	中華民國：202334291(公開號) 大陸：CN116709716A(公開號) 美國：2023-0139367(公開號)
專利權人	國立清華大學 100.00%
發明人	萬德輝,陳學禮,黃靖文,陳彥任,張思偉
技術領域	能源科技,電子電機

專利摘要(英)
A thermal radiation heat dissipation device for an electronic component includes a heat dissipation substrate including a heat dissipation surface having a heat dissipation surface emissivity; and an emissivity modulation layer disposed on the heat dissipation surface including an emissivity modulation layer surface having an emissivity modulation layer surface emissivity. The emissivity modulation layer surface emissivity is greater the heat dissipation surface emissivity.

專利摘要(英)

A thermal radiation heat dissipation device for an electronic component includes a heat dissipation substrate including a heat dissipation surface having a heat dissipation surface emissivity; and an emissivity modulation layer disposed on the heat dissipation surface including an emissivity modulation layer surface having an emissivity modulation layer surface emissivity. The emissivity modulation layer surface emissivity is greater the heat dissipation surface emissivity.

聯絡資訊
承辦人姓名	李曉琪
承辦人電話	03-5715131 #31061
承辦人Email	hsiaochi@mx.nthu.edu.tw