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專利授權區

專利授權區
專利名稱(中)	VAPOR CHAMBER DEVICE
專利家族	中華民國：I733272 大陸：6360018 美國：US11,644,250B2
專利權人	國立清華大學 100% ,永善精密股份有限公司 0%
發明人	王訓忠
技術領域	能源科技,機械結構

專利摘要(中)
A vapor chamber device adapted to be thermally coupled to a heat source includes a first casing and a second casing. The first casing includes a first plate, a first capillary structure at an inner surface of the first plate, and a first lateral wall protruding from the inner surface and surrounding the first capillary structure. The heat source is adapted to contact an outer surface of the first plate. The second casing is stacked on the first casing and includes a second plate, a plurality of supporting posts protruding from the second plate, and a second lateral wall protruding from the second plate and surrounding the supporting posts. The supporting posts face towards the first capillary structure, and the first lateral wall is connected to the second lateral wall. The vapor chamber device includes a second capillary structure disposed between the first capillary structure and the supporting posts, and a third capillary structure disposed in an area which is at the inner surface of the first plate and corresponds to the heat source.

專利摘要(中)

A vapor chamber device adapted to be thermally coupled to a heat source includes a first casing and a second casing. The first casing includes a first plate, a first capillary structure at an inner surface of the first plate, and a first lateral wall protruding from the inner surface and surrounding the first capillary structure. The heat source is adapted to contact an outer surface of the first plate. The second casing is stacked on the first casing and includes a second plate, a plurality of supporting posts protruding from the second plate, and a second lateral wall protruding from the second plate and surrounding the supporting posts. The supporting posts face towards the first capillary structure, and the first lateral wall is connected to the second lateral wall. The vapor chamber device includes a second capillary structure disposed between the first capillary structure and the supporting posts, and a third capillary structure disposed in an area which is at the inner surface of the first plate and corresponds to the heat source.

聯絡資訊
承辦人姓名	劉千綺
承辦人電話	03-571-5131 #31181
承辦人Email	chienchi@mx.nthu.edu.tw