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專利授權區
專利名稱(英)	Method for making nano-scale lead-free solder
專利家族	美國：7,291,201
專利權人	國立清華大學 100%
發明人	蕭立殷,杜正恭
技術領域	材料化工

專利摘要(中)
A method for making Nano-scale lead-free solder includes the following steps of: forming a mixture solution Sn-Ag or Sn-Ag-Cu; making NaBH.sub.4, NaOH and alkyl C.sub.12H.sub.25OSO.sub.3Na to a reducing dispersing solution; producing reactant Sn-Ag or Sn-Ag-Cu by means of the oxidation reduction method; and adding 95％ ethanol to be mixed, and cleaning the reactant by using a supersonic vibrator for removing boron (B) and sulfur (S) atom which adhere to the reactant, thereby producing the Nano-scale (0.1.about.100 nm) lead-free solder Sn-3.5Ag or Sn-3.5Ag-xCu (x=0.2.about.1.0).

專利摘要(中)

A method for making Nano-scale lead-free solder includes the following steps of: forming a mixture solution Sn-Ag or Sn-Ag-Cu; making NaBH.sub.4, NaOH and alkyl C.sub.12H.sub.25OSO.sub.3Na to a reducing dispersing solution; producing reactant Sn-Ag or Sn-Ag-Cu by means of the oxidation reduction method; and adding 95％ ethanol to be mixed, and cleaning the reactant by using a supersonic vibrator for removing boron (B) and sulfur (S) atom which adhere to the reactant, thereby producing the Nano-scale (0.1.about.100 nm) lead-free solder Sn-3.5Ag or Sn-3.5Ag-xCu (x=0.2.about.1.0).

專利摘要(英)
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聯絡資訊
承辦人姓名	楊美茹
承辦人電話	03-5715131 #62305
承辦人Email	mjyang2@mx.nthu.edu.tw