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專利授權區

專利授權區
專利名稱(英)	Microchannel Flat-Plate Heat Pipe with Paralle Grooves for Recycling Coolant
專利家族	美國：7,234,513
專利權人	國立清華大學 100%
發明人	王訓忠
技術領域	機械結構

專利摘要(中)
Heat from a heat generating device such as a CPU is dissipated by a heat sink device containing a recycled two-phase vaporizable coolant. The coolant recycles inside a closed metal chamber, which has an upper section and a lower section connected by a conveying conduit, and a wick evaporator placed in the lower section. The liquid coolant in the evaporator is vaporized by the heat from the heat generating device. The coolant vapor enters the upper section and condenses therein, with the liberated latent heat dissipated out through the inner top chamber wall. The condensed coolant is then collected and flows into the lower section, and further flows back to the wick evaporator by capillary action of the evaporator, thereby recycling the coolant. Space or a piece of element with parallel grooves is used to form at least one of the sections to reduce friction in the liquid flow path.

專利摘要(中)

Heat from a heat generating device such as a CPU is dissipated by a heat sink device containing a recycled two-phase vaporizable coolant. The coolant recycles inside a closed metal chamber, which has an upper section and a lower section connected by a conveying conduit, and a wick evaporator placed in the lower section. The liquid coolant in the evaporator is vaporized by the heat from the heat generating device. The coolant vapor enters the upper section and condenses therein, with the liberated latent heat dissipated out through the inner top chamber wall. The condensed coolant is then collected and flows into the lower section, and further flows back to the wick evaporator by capillary action of the evaporator, thereby recycling the coolant. Space or a piece of element with parallel grooves is used to form at least one of the sections to reduce friction in the liquid flow path.

專利摘要(英)
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聯絡資訊
承辦人姓名	劉千綺
承辦人電話	03-571-5131 #31181
承辦人Email	chienchi@mx.nthu.edu.tw