A laser processing system configured to provide a processing beam is provided. The laser processing system includes a laser, a beam splitting module, a first adjustment module, and a second adjustment module. The laser is configured to provide a laser beam. The beam splitting module is configured to split the laser beam into a first laser beam and a second laser beam. The first adjustment module is disposed on a transmission path of the first laser beam and configured to adjust the first laser beam to a central portion of the processing beam. The second adjustment module is disposed on a transmission path of the second laser beam and configured to adjust the second laser beam to an outer ring portion of the processing beam. |