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專利授權區
專利名稱(中) 均溫板結構
專利名稱(英) VAPOR CHAMBER STRUCTURE
專利家族 中華民國:I701419
專利權人 國立清華大學 100.00%
發明人 林唯耕,蔡罄鍠
技術領域 能源科技
專利摘要(中)
本發明的均溫板結構包括第一板體、第二板體、及至少一個毛細網體。第一板體具有第一內表面,並於第一內表面上形成具有深度的第一凹陷部,於第一板體的第一內表面的邊緣形成環狀的第一儲液流道,於第一儲液流道與第一凹陷部之間設置多個闊口流道;第二板體具有第二內表面,並於第二內表面上形成具有深度的第二凹陷部,於第二板體的第二內表面的邊緣形成環狀的第二儲液流道,於第二儲液流道與第二凹陷部之間設置多個縮口流道;多個闊口流道及多個縮口流道可加速均溫板結構內工作流體的流動速度,進而提升循環移熱的效率。
專利摘要(英)
A vapor chamber structure is provided. The vapor chamber structure comprises a first plate, a second plate, and at least one capillary foil. The first plate comprises a first inner surface where a first recessed part with a depth is formed, a first flow reservoir formed cyclicly at an edge of the first inner surface, and plurality of expanding flow channels formed between the first flow reservoir and the first recessed part. The second plate comprises a second inner surface where a second recessed part with a depth is formed, a second flow reservoir formed as a loop at a edge of the second inner surface, and plurality of reducing flow channels formed between the second flow reservoir and the second recessed part. Plurality of expanding flow channels and plurality of reducing flow channels can accelerate flowing speed of a working fluid in the vapor chamber structure so that heat circulating and transferring efficiency is improved.
聯絡資訊
承辦人姓名 楊美茹
承辦人電話 03-5715131 #62305
承辦人Email mjyang2@mx.nthu.edu.tw
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