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專利授權區

專利授權區
專利名稱(中)	均溫板裝置
專利名稱(英)	VAPOR CHAMBER DEVICE
專利家族	中華民國：I842472 日本：7571211 歐盟：4446684(公開號) 美國：US-2024-0344773-A1(公開號)
專利權人	國立清華大學 100% ,國立清華大學 100%
發明人	王訓忠
技術領域	能源科技,機械結構,電子電機

專利摘要(英)
A vapor chamber device includes a first casing, a first capillary structure and a second casing. The first casing includes a first plate portion, first protrusions and a first side wall. The first capillary structure is disposed over an inner bottom surface of the first plate portion and surrounds the first protrusions. The second casing is stacked on the first casing, and the second casing includes a second plate portion, second protrusions and a second side wall. The first side wall is connected to the second side wall, and steam passages are formed between the second protrusions. The second plate portion includes connecting areas for the second protrusions, and the first protrusions are connected to the connecting areas. These second protrusions press against the first capillary structure.

專利摘要(英)

A vapor chamber device includes a first casing, a first capillary structure and a second casing. The first casing includes a first plate portion, first protrusions and a first side wall. The first capillary structure is disposed over an inner bottom surface of the first plate portion and surrounds the first protrusions. The second casing is stacked on the first casing, and the second casing includes a second plate portion, second protrusions and a second side wall. The first side wall is connected to the second side wall, and steam passages are formed between the second protrusions. The second plate portion includes connecting areas for the second protrusions, and the first protrusions are connected to the connecting areas. These second protrusions press against the first capillary structure.

聯絡資訊
承辦人姓名	劉千綺
承辦人電話	03-571-5131 #31181
承辦人Email	chienchi@mx.nthu.edu.tw