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專利授權區
專利名稱(中)	使用高附著性觸媒的無矽烷無電鍍金屬沉積方法及其生成物
專利名稱(英)	A METHOD FOR NO-SILANE ELECTROLESS PLATING OF METAL USING HIGH ADHESIVE CATALYST AND THE PRODUCT THEREFROM
專利家族	中華民國：I608124
專利權人
發明人	王偉彥,許晉偉,衛子健
技術領域	材料化工,光電光學

專利摘要(中)
一種使用高附著性觸媒的無矽烷無電鍍金屬沉積方法包括：a)提供一基板，對基板進行一表面改質步驟，以在基板之一表面進行氫氧化以形成一親水的化學氧化層；b)在化學氧化層上形成一觸媒層，觸媒層包括複數個膠體奈米粒子團，每一膠體奈米粒子團包括一鈀奈米粒子及一包覆鈀奈米粒子的聚乙烯醇高分子聚合物；以及c)進行一無電鍍金屬沉積，使金屬沉積於觸媒層上以形成一無電鍍金屬層。本說明書亦提供一包含無矽烷無電鍍金屬層的基板。 A method for no-silane electroless plating of metal using high adhesive catalyst includes: a) providing a substrate, and the substrate having a surface which is subjected a surface modification to form a layer of hydrophilic wet chemical oxide; b) forming a catalyst layer on the layer of hydrophilic wet chemical oxide, the catalyst layer including a plurality of colloid nanoparticles, and each of the colloid nanoparticles including a palladium nanoparticle and a palladium nanoparticle wrapped polyvinyl alcohol polymer; and c) conducting the electroless plating of metal, and the metal being deposited on the catalyst layer to form an electroless plating metal layer. A substrate including no-silane electroless plating metal layer is also provided.

專利摘要(中)

一種使用高附著性觸媒的無矽烷無電鍍金屬沉積方法包括：a)提供一基板，對基板進行一表面改質步驟，以在基板之一表面進行氫氧化以形成一親水的化學氧化層；b)在化學氧化層上形成一觸媒層，觸媒層包括複數個膠體奈米粒子團，每一膠體奈米粒子團包括一鈀奈米粒子及一包覆鈀奈米粒子的聚乙烯醇高分子聚合物；以及c)進行一無電鍍金屬沉積，使金屬沉積於觸媒層上以形成一無電鍍金屬層。本說明書亦提供一包含無矽烷無電鍍金屬層的基板。 A method for no-silane electroless plating of metal using high adhesive catalyst includes: a) providing a substrate, and the substrate having a surface which is subjected a surface modification to form a layer of hydrophilic wet chemical oxide; b) forming a catalyst layer on the layer of hydrophilic wet chemical oxide, the catalyst layer including a plurality of colloid nanoparticles, and each of the colloid nanoparticles including a palladium nanoparticle and a palladium nanoparticle wrapped polyvinyl alcohol polymer; and c) conducting the electroless plating of metal, and the metal being deposited on the catalyst layer to form an electroless plating metal layer. A substrate including no-silane electroless plating metal layer is also provided.

聯絡資訊
承辦人姓名	李佳玲
承辦人電話	03-5715131 #62300
承辦人Email	cl.lee@mx.nthu.edu.tw