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專利授權區
專利名稱(中)	均溫板裝置
專利名稱(英)	VAPOR CHAMBER DEVICE
專利家族	美國：US-2024-0302108-A1(公開號)
專利權人	國立清華大學 100.00% ,永善精密股份有限公司 0.00%
發明人	王訓忠
技術領域	能源科技,機械結構

專利摘要(中)
一種均溫板裝置，適於熱耦合於熱源，均溫板裝置包括第一殼體及第二殼體。第一殼體包括第一板部、位於第一板部的內表面的第一毛細結構及凸出內表面且環繞第一毛細結構的第一側牆，其中熱源適於接觸第一板部的外表面。第二殼體疊置於第一殼體，且包括第二板部、凸出於第二板部的多個支撐柱及凸出第二板部且環繞這些支撐柱的第二側牆。支撐柱朝向第一毛細結構，且第一側牆接合於第二側牆。均溫板裝置包括第二毛細結構及第三毛細結構。第二毛細結構配置於第一毛細結構及支撐柱之間。第三毛細結構設置於第一板部的內表面在對應於熱源的區域。

專利摘要(中)

一種均溫板裝置，適於熱耦合於熱源，均溫板裝置包括第一殼體及第二殼體。第一殼體包括第一板部、位於第一板部的內表面的第一毛細結構及凸出內表面且環繞第一毛細結構的第一側牆，其中熱源適於接觸第一板部的外表面。第二殼體疊置於第一殼體，且包括第二板部、凸出於第二板部的多個支撐柱及凸出第二板部且環繞這些支撐柱的第二側牆。支撐柱朝向第一毛細結構，且第一側牆接合於第二側牆。均溫板裝置包括第二毛細結構及第三毛細結構。第二毛細結構配置於第一毛細結構及支撐柱之間。第三毛細結構設置於第一板部的內表面在對應於熱源的區域。

專利摘要(英)
A vapor chamber device adapted to be thermally coupled to a heat source includes a first casing and a second casing. The first casing includes a first plate, a first capillary structure at an inner surface of the first plate, and a first lateral wall protruding from the inner surface and surrounding the first capillary structure. The heat source is adapted to contact an outer surface of the first plate. The second casing is stacked on the first casing and includes a second plate, a plurality of supporting posts protruding from the second plate, and a second lateral wall protruding from the second plate and surrounding the supporting posts. The supporting posts face towards the first capillary structure, and the first lateral wall is connected to the second lateral wall. The vapor chamber device includes a second capillary structure disposed between the first capillary structure and the supporting posts, and a third capillary structure disposed in an area which is at the inner surface of the first plate and corresponds to the heat source.

專利摘要(英)

A vapor chamber device adapted to be thermally coupled to a heat source includes a first casing and a second casing. The first casing includes a first plate, a first capillary structure at an inner surface of the first plate, and a first lateral wall protruding from the inner surface and surrounding the first capillary structure. The heat source is adapted to contact an outer surface of the first plate. The second casing is stacked on the first casing and includes a second plate, a plurality of supporting posts protruding from the second plate, and a second lateral wall protruding from the second plate and surrounding the supporting posts. The supporting posts face towards the first capillary structure, and the first lateral wall is connected to the second lateral wall. The vapor chamber device includes a second capillary structure disposed between the first capillary structure and the supporting posts, and a third capillary structure disposed in an area which is at the inner surface of the first plate and corresponds to the heat source.

聯絡資訊
承辦人姓名	劉千綺
承辦人電話	03-571-5131 #31181
承辦人Email	chienchi@mx.nthu.edu.tw