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專利授權區
專利名稱(中) 可修復且可回收之聚醯亞胺高分子樹脂及其修復與回收方法
專利名稱(英) HEALABLE AND RECYCLABLE POLYIMIDE POLYMER RESIN AND HEALING AND RECYCLING METHOD THEREOF
專利家族 中華民國:I827139
大陸:CN117402355(公開號)
日本:特開2024-12127(公開號)
美國:US-2024-0018330-A1(公開號)
韓國:10-2024-0009360(公開號)
專利權人 國立清華大學 100.00%
發明人 周鶴修,莊貴貽
技術領域 光電光學
專利摘要(中)
本發明提供一種可修復且可回收之聚醯亞胺高分子樹脂及其修復與回收方法。可修復且可回收之聚醯亞胺高分子樹脂包含如式(I)所示之一化學結構單元: 式(I); 式(I)中各符號如說明書中所定義。前述之修復方法係於一修復溫度下,對可修復且可回收之聚醯亞胺高分子樹脂以一修復方式進行修復。前述之回收方法係將可修復且可回收之聚醯亞胺高分子樹脂溶解於一二乙烯三胺溶液中,再進行塗佈與烘烤成膜,以形成一回收聚醯亞胺膜。藉此,前述之可修復且可回收之聚醯亞胺高分子樹脂具有剛硬、抗化、耐熱、可修復且可回收的特性。
專利摘要(英)
The invention relates to a healable and recyclable polyimide polymer resin, a healing method and a recycling method thereof. The healable and recyclable polyimide polymer resin includes a chemical structural unit represented by Formula (I): Formula (I). In Formula (I), each symbol is defined in the description. In the repairing method, the healable and recyclable polyimide polymer resin is healed by a healing means at a healing temperature. In the recycling method, the healable and recyclable polyimide polymer resin is dissolved in a diethylenetriamine solution for further coating and baking to form a recycled polyimide film. Therefore, the healable and recyclable polyimide polymer resin is rigid, chemical-resistant, heat-resistant, healable and recyclable.
聯絡資訊
承辦人姓名 李馥如
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