A piezoelectric transducer device includes a supporting substrate composing of silicon and having a cavity, a piezoelectric unit, a connecting layer and an electrical connecting unit. The piezoelectric unit involves a titanium foil, two piezoelectric layers fabricated by hydrothermal process, and a opening which forms on the side of the piezoelectric unit opposite to the supporting substrate and makes the titanium foil exposed. The electrical connecting unit involves a top electrode and a contact pad which electrically connects to the titanium foil, so that the titanium foil can be used as a supporting structure and a bottom electrode, and the piezoelectric transducer device can be reduced in weight. Moreover, connecting the supporting substrate and the piezoelectric unit by the connecting layer can prevent the supporting substrate from damaging during the hydrothermal process. Besides, this invention provides a fabricating method for the piezoelectric transducer device. |