專利授權區國立清華大學國際產學營運總中心 Operations Center for Industry Collaboration

專利授權區
專利名稱(英)	METHOD FOR TESTING THROUGH-SILICON-VIA
專利家族	美國：8,937,486
專利權人	國立清華大學 100%
發明人	蒯定明,陳柏源,吳誠文,周永發
技術領域	電子電機

專利摘要(英)
A method for testing a TSV comprises charging a through-silicon-via under test to a first predetermined voltage level charging a capacitance device to a second predetermined voltage level; performing charge-sharing between the through-silicon-via and the capacitance device; and determining that the through-silicon-via under test is not faulty if the voltage level of the through-silicon-via after the charge-sharing step is within a predetermined range.

專利摘要(英)

A method for testing a TSV comprises charging a through-silicon-via under test to a first predetermined voltage level charging a capacitance device to a second predetermined voltage level; performing charge-sharing between the through-silicon-via and the capacitance device; and determining that the through-silicon-via under test is not faulty if the voltage level of the through-silicon-via after the charge-sharing step is within a predetermined range.

聯絡資訊
承辦人姓名	李曉琪
承辦人電話	03-5715131 #31061
承辦人Email	hsiaochi@mx.nthu.edu.tw

電　話：

+886-3-5162301

傳　真：

+886-3-5162275

信　箱：

ocic@my.nthu.edu.tw

地　址：

300044 新竹市光復路二段101號國立清華大學創新育成大樓 111室