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專利授權區

專利授權區
專利名稱(英)	ALL-INORGANIC UP-CONVERSION DISPLAY
專利家族	中華民國：I852561 大陸：CN119008608A(公開號) 美國：2024-0387494(公開號)
專利權人	國立清華大學 100.00%
發明人	吳孟奇
技術領域	通信傳輸,光電光學

專利摘要(英)
An all-inorganic up-conversion display includes a photodiode array and a light emitting diode array. The photodiode array includes a first substrate having a first conductivity type, a buffer layer formed on a first surface of the first substrate, an absorption layer formed on the buffer layer, a cap layer formed on the absorption layer, a first patterned passivation layer formed on the cap layer and exposing an array of contact regions of the cap layer, a common first electrode connected to the first substrate, an array of second electrodes, and an array of first solder bumps. The light emitting array includes a second substrate, an array of luminous chips, a common third electrode, a second patterned passivation layer, and an array of second solder bumps. Each of the first solder bumps is flip-chip bonded to a corresponding one of the second solder bumps.

專利摘要(英)

An all-inorganic up-conversion display includes a photodiode array and a light emitting diode array. The photodiode array includes a first substrate having a first conductivity type, a buffer layer formed on a first surface of the first substrate, an absorption layer formed on the buffer layer, a cap layer formed on the absorption layer, a first patterned passivation layer formed on the cap layer and exposing an array of contact regions of the cap layer, a common first electrode connected to the first substrate, an array of second electrodes, and an array of first solder bumps. The light emitting array includes a second substrate, an array of luminous chips, a common third electrode, a second patterned passivation layer, and an array of second solder bumps. Each of the first solder bumps is flip-chip bonded to a corresponding one of the second solder bumps.

聯絡資訊
承辦人姓名	李曉琪
承辦人電話	03-5715131 #31061
承辦人Email	hsiaochi@mx.nthu.edu.tw