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專利授權區

專利授權區
專利名稱(中)	金屬化基板表面的方法及具有金屬化表面的基板
專利名稱(英)	SUBSTRATE SURFACE METALLIZATION METHOD AND SUBSTRATE HAVING METALLIZED SURFACE MANUFACTURED BY THE SAME
專利家族	美國：9,875,984
專利權人
發明人	陳奎伯,黃桂武,賴奎璋,歐乃天,吳中瀚,潘贈傑,陳志銘,衛子健
技術領域	材料化工,能源科技,光電光學

專利摘要(中)
A substrate having a metallized surface is provided. The substrate includes a substrate having a silanated surface, an adhesive layer disposed on the silanated surface, and a first metallic layer bonded to the silanated surface through the adhesive layer. The adhesive layer is formed with a plurality of colloidal nanoparticle groups, and the colloidal nanoparticle group may include metallic nanoparticles capped with polymer. The first metallic layer and the adhesive layer have chemical bonds formed there between. The substrate may further include a second metallic layer which is electro-plated onto the first metallic layer. A method for metallizing a surface of a substrate is also provided.

專利摘要(中)

A substrate having a metallized surface is provided. The substrate includes a substrate having a silanated surface, an adhesive layer disposed on the silanated surface, and a first metallic layer bonded to the silanated surface through the adhesive layer. The adhesive layer is formed with a plurality of colloidal nanoparticle groups, and the colloidal nanoparticle group may include metallic nanoparticles capped with polymer. The first metallic layer and the adhesive layer have chemical bonds formed there between. The substrate may further include a second metallic layer which is electro-plated onto the first metallic layer. A method for metallizing a surface of a substrate is also provided.

聯絡資訊
承辦人姓名	李佳玲
承辦人電話	03-5715131 #62300
承辦人Email	cl.lee@mx.nthu.edu.tw